TP200-H45-SF

TP200-H45-SF
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Thermal conductivity (W/m·K) 2.0
Thermal conductivity (W/m·K) Test Standard ISO 22007-2
Density (g/cc) 2.5
Density (g/cc) Test Standard ASTM D792
Hardness (Shore 00) 45~55
Hardness (Shore 00) Test Standard ASTM D2240
Operating temperature range (°C) -40~125
Operating temperature range (°C) Test Standard IEC 60068-2-14
Color Green
Color Test Standard Visual
Thickness (mm) 1.0~4.0
Thickness (mm) Test Standard ASTM D374
Flammability V-0
Flammability Test Standard UL 94
Breakdown voltage (kV/mm) ≥6.0
Breakdown voltage (kV/mm) Test Standard ASTM D149
Dielectric constant (1 MHz) 1.5 × 10 10 ~10 11
Dielectric constant (1 MHz) Test Standard ASTM D150
Weight loss (%) ≤1.0
Weight loss (%) Test Standard ASTM E1131
TDS datasheet Download TDS
TDS datasheet Test Standard PDF

Description

Product Introduction

Selling point: Silicone-free thermal pad. Typical application: 2 W/(m·K) gap filler for medical and precision equipment.

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