HGP10

HGP10
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Thermal conductivity (W/m·K) 90
Thermal conductivity (W/m·K) Test Standard ISO 22007-2
Density (g/cc) <0.95
Density (g/cc) Test Standard ASTM D792
Operating temperature range (°C) -40~150
Operating temperature range (°C) Test Standard IEC 60068-2-14
Color Gray-black
Color Test Standard Visual
Thermal resistance (°C·cm²/W) ≤0.10 @40psi
Thermal resistance (°C·cm²/W) Test Standard ASTM D5470
Thickness (mm) 0.2-2.0
Thickness (mm) Test Standard ASTM D374
Standard sheet size (mm) 60 × 60
Standard sheet size (mm) Test Standard ASTM D5946
Compression (%) ≥40 @40psi
Compression (%) Test Standard ASTM D575
Compressive stress (psi) ≤60 @50%
Compressive stress (psi) Test Standard ASTM D575
Resilience (%) ≥60
Resilience (%) Test Standard ASTM D575
Creep (mm) ≤1
Creep (mm) Test Standard ASTM D575
Shelf life (years) 2
Shelf life (years) Test Standard -
Maximum size (mm) 100 × 100
Maximum size (mm) Test Standard -
Storage conditions Protect from light; storage temp ≤ 30°C; humidity ≤ 70%; stack ≤ 5 layers, total height ≤ 1 m
Storage conditions Test Standard -
Edge-wrappable & dispensable Supported
Edge-wrappable & dispensable Test Standard -
TDS datasheet Download TDS
TDS datasheet Test Standard PDF

Description

Product Introduction

Selling point: Graphene thermal pad. Typical application: low thermal resistance edging and dispensing for high-power modules.

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