GF200-L

GF200-L
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Thermal conductivity (W/m·K) 2.0
Thermal conductivity (W/m·K) Test Standard ISO 22007-2
Density (g/cc) 2.5
Density (g/cc) Test Standard ASTM D792
Operating temperature range (°C) -40~150
Operating temperature range (°C) Test Standard IEC 60068-2-14
Color Pink / white
Color Test Standard Visual
Flammability V-0
Flammability Test Standard UL 94
Tensile strength (MPa) ≥0.05
Tensile strength (MPa) Test Standard ASTM D412
Tear strength (N/mm) ≥0.1
Tear strength (N/mm) Test Standard ASTM D624
Breakdown voltage (kV/mm) >7.0
Breakdown voltage (kV/mm) Test Standard ASTM D149
Volume resistivity (Ω·cm) >10 11
Volume resistivity (Ω·cm) Test Standard ASTM D257
Dielectric constant (1 MHz) 6.0
Dielectric constant (1 MHz) Test Standard ASTM D150
Low-molecular siloxane content D3–D20 (ppm) ≤100
Low-molecular siloxane content D3–D20 (ppm) Test Standard GC-FID
Curing time (min/h) <24
Curing time (min/h) Test Standard Time for mixed A&B viscosity to double from the initial value
Working time (h) 1~1.5
Working time (h) Test Standard Time for mixed A&B viscosity to double from the initial value
Elongation at break (%) >30
Elongation at break (%) Test Standard ASTM D412
CTE (ppm) 120
CTE (ppm) Test Standard ASTM E831-2014
TDS datasheet Download TDS
TDS datasheet Test Standard PDF

Description

Product Introduction

Selling point: Low-volatility thermal potting compound. Typical application: AB two-component electronic encapsulation.

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